TPSM82903: The value of Package Body thickness for bake condition

Hi,

Module has integrated the inductor internal. And below is the reflow case temperature, storage temperature and so on.

Thanks

Colin

Hi Colin

Thank you for reply !
However There's something different that I wanted to ask.
We would like to ask you how to think about Package Body Thickness when choosing baking conditions.

If we assum Package Body Thickness of TPSM82903SISR is 1.6mm,
We have to refer the value whose parameter of ackage Body Thickness is "1.4 mm ≤ 2.0 mm" in Table 5 in AN-2029.

If we assum Package Body Thickness of TPSM82903SISR is 0.34mm,
We have to refer the value whose parameter of ackage Body Thickness is "< 0.5 mm" in Table 5 in AN-2029.

(MSL of TPSM82903SISR is Level 2)

Which assumption is correct?

Hi,

Give me some time to look at it and will get back to you soon.

Thanks

Colin

Hi Sir,

Baking is required prior to the reflow process in order to remove any moisture out of the plastic package.

1.6mm is the thickness which including inductor that don't need baking.

0.34mm is the thickness of  SMD pads (plastic) and it should be refer as parameter for baking.

Thanks

Colin

Hi Colin,

Thank you for reply !