TLV766-Q1: Thermal Simulation Failure and thermal resistance information confirmation

Tool/software:

Hi expert,

I used TLV76601QWDRBRQ1 in my project and the maximum load current is 330mA. However, its Tj will reach 158C in an environment of 85C, and thermal simulation fails. We designed a heat dissipation boss on the top of the chip, but from the thermal resistance information, RθJC(top)>RθJA, which is very strange, so the heat dissipation boss has limited effect.

Could you help confirm the thermal resistance information? Since the design has been released, is there a P2P device with better thermal resistance that can be selected?

Thanks!

Harvey