Other Parts Discussed in Thread: BQ25792, BQ25798
Tool/software:
Hi TIer
My customer uses BQ25790 to design low cost portable products. He sees that BGA packaging has to make the PCB produce blind or buried holes, or 0.4 mil aperture, which requires the use of laser or more complex manufacturing process, so this will increase the customer's cost. Any optimization suggestions? I asked the customer to refer to the schematics of our EVM board, and they didn't have a good idea. Please give me some advice. Thank you.
