TPS51604: I have a question regarding MSL changes.

hello,

Where did you find the device was with MSL2?

Regards

Hi､

Thanks for the reply.
Unfortunately it was found during our customer's incoming inspection.

Then I learned about the changes to the data sheet when it was pointed out to me.

Hello, 

I'm not aware of MSL change. It could be a typo.

Regards

Mahmoud-san,

Thank you.
Is there a document somewhere about the packing specifications when the dry packs run out?

Best regards,

Hello,

I'm not sure if this document is available. Is it a standard document? have you order it before?

Regards,

Mahmoud-san,

We have not had any requests from customers for packaging specifications without dry packs, so we do not have them.
This time, contamination of leadframes occurred at the customer's plant, and the customer considers the removal of dry packs as one of the possibilities, leading to a request for packaging specifications.

regards,

Hello,

I'm asking the ATE site for the information and will post the answer it once received it.

Regards

Good day.

A customer had an additional question.
Customer's concern about moisture barrier pack removal has not subsided.

1. Please submit evaluation results (SAT) confirming that peeling due to moisture
absorption is not a problem after the moisture barrier pack has been removed.
(Customers are also concerned about terminal oxidation due to moisture barrier pack deletion)

2. Therefore, please submit evaluation results (e.g., photos showing wettability) confirming
that solder wettability is not a problem after the moisture barrier pack is removed.

Best regards,
T.Sako

Hello,

sorry for my late answer. I'm double checking with the ATE site and ask them to provide the info asap.

Regards

Here is MSL for TPS51604DSGR, it is MSL 1.

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