This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Tool/software:
Hi Team,
In customer's project, the thermal cooling solution to be evaluated is by attaching the top cover with a thermal pad . As the pad will be compressed, there will be a counter force on the top of the component. We would like to evaluate and control such a long-term compress force. Can you provide the details regarding the maximum allowable long-term pressure for TPS74801?
Regards,
Hailiang
Hi Hailiang,
I have requested this information from the packaging group. Should be able to get back to you with an answer by middle of this week.
The maximum recommended force is 20N uniformly applied to the top-side of the package perpendicular to the mounting surface.
How are they planning on drawing the actual heat out of the package from the topside if there is no connection to the die?
Hi Ishaan,
How are they planning on drawing the actual heat out of the package from the topside if there is no connection to the die?
The heat sink will be in contact with the top of the IC package.
Regards,
Hailiang