This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LP38693-ADJ: PCN 20240628007.1

Part Number: LP38693-ADJ

Tool/software:

Hello, 

PCN 20240628007.1 states that mold compound in LP38693SD-ADJ/NOPB and LP38693SDX-ADJ/NOPB changes from 4208625 to 4222198. Does this change increase, decrease or has no impact on the junction-to-case thermal resistance of these parts?

Thank You