TPS62825A: Question about mounting specs

Makoto Oka

Part Number: TPS62825A

Tool/software:

1: Can mounting reliability be ensured when the unplated lead sides are not soldered (connected only at the bottom)?
2: If solder connection on the sides is essential, are there any conditions to prevent deterioration and oxidation of the substrate to ensure solder connection on the exposed side of the terminal?

over 1 year ago

0 Varun John over 1 year ago

TI__Mastermind 21560 points

Hi Makoto,

1. Part of the lead sides are plated, so this part should have some solder after the reflow process if the part is soldered correctly.

2. The MSL rating for the part should be adhered to for ensuring proper soldering. In this case the part is rated MSL 1, that means unlimited floor life at 85% moisture relative humidity.

You can refer to these material for more info on wettable flanks-

https://www.ti.com/document-viewer/ja-jp/lit/html/sszt820
https://www.ti.com/video/5083767938001

Best regards,

Varun

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TPS62825A: Question about mounting specs