TPS62876-Q1: TPS62876 thermal model and Rth vs. Psi

Hello Mateusz,

Thanks for reaching out to us.

Please see my response below in blue.

1. Have you got thermal model for mentioned converter? Yes, we have the thermal model  in .pdml format. Can you use it in your simulation tool?

2. What parameter Ψ or RθJ do you propose to use for thermal simulation with radiator and without radiator? Converter is soldered to PCB by all pins and thermal pad. 

Can you kindly clarify what do you mean by "with radiator and w/o radiator"? Do you mean if the thermal model includes radiation heat transfer?

Best regards,

Excel

Hello Excel,

thank you for quick response.

1. Yes., .pdml format will be fine for us. Could share to us this thermal model, please?

2. No, I mean about two cases in simulation. Our product there is at aluminium cover. We are considering two scenarios, one when pedestal from aluminium case touch converter and second scenario when there isn't pedestal to converter. Question is which parameter Ψ or RθJ we should use to our simulation at mentioned cases?

Best regards,

Mateusz

Hello Mateusz,

Please see the attached .pdml model for your reference.

For item 2, if the aluminum case is connected to the top side package of the IC, use RTheta-JC (Top) parameter. If not, then use Ψ-JT.

I hope I was able to address your queries.

https://e2e.ti.com/cfs-file/__key/communityserver-discussions-components-files/196/TPS62876_2D00_Q1_5F00_2R_5F00_CTM.pdml

Best regards,

Excel

Hello Excel,

thank you for model and for your help.

Best regards,

Mateusz