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Tool/software:
Looking at the datasheet of TPS25961, there isn't a directly dimensioned minimum distance between the pins and the exposed pad. I can work out a minimum distance indirectly by using the dimensions given:
(1.9mm - (1mm + 0.1mm) - 0.3mm - 0.3mm) / 2 = 0.1mm
but that seems unrealistically pessimistic. I calculate the nominal as 0.25mm. For my application, I need the minimum to be at least 0.15mm. Can TI confirm this dimension is at least 0.15mm?
Hi Chris,
Yes, the calculation looks too pessimistic. As you mentioned nominal calculation is .25mm which will be the case for most devices.
I am getting a confirmation from product team regarding 0.15mm as minimum dimension. Please give us time till next week. I will get back to you as soon as I get the reply.
Best Regards,
Arush
We have checked in model viewer, minimum distance between exposed thermal pad and pins is 0.25mm.
The nominal of the drawing is also 0.25mm, so does the model viewer just represent the nominal. If so I need to know what tolerance should we apply to that?
Hi Chris,
We checked char data for this device. This is based on 30 device and this is just a reference.
Device width x_min = 1.970
Pin length max = 0.278
ground pad worst case from above diagram = 1.1
So new calculation becomes (1.970 - 1.1)/2 - 0.278 = 0.157mm > 0.15mm.
I hope this helps.
Best Regards,
Arush
Hi, Thank you for sharing this data which is good news.
To understand a minimum component count implementation, does TI advise against connecting EN/UVLO directly to VIN, even in applications below 5V? The TPS25961 datasheet shows an implementation for 3.3V and low current (copied below) that uses a 47k resistor pullup rather than a direct connection. Will a direct connection just increase pin leakage of is there any more significant reason to avoid?
Hi Chris,
For this device EN can be pulled up directly to the Vin for supply less than 5V.
Best regards,
Arush