TLV741P: Solderbility about "Cut side of the Cu frame"

Takahiro SEZAI

Part Number: TLV741P

Tool/software:

Dear Ti Engineer.

This is SEZAI. (Murata Mfg. Co ltd. Quality Engineer)

We (Murata Manufacturing Co., Ltd.) know that the solderbility of exposed Cu (frame cut surface) on the side surface of PKG decreases due to oxidation.

Dear Ti, we will use TLV74133PDQNR, TPS62825ADMQR, and confirmed the same structure, so please answer to [Question].

Refference image

[Question]

1) As a Ti product, is solderablity of Cu exposed part on the side of PKG guaranteed? (Y: Guaranteed / N: Not guaranteed)

2) If the plated Pad surface is solderred, is there no concern about electrical characteristics and reliability as Ti parts? (Y: no concern / N: concern)

Best regards Takahiro SEZAI

**************************************************************

Takahiro SEZAI

Quality Engineering Section 1,

Quality Assurance Department 2,

Quality Assurance Group

Murata Manufacturing Co.,Ltd.

Address: Nagaokakyo-shi,Kyoto 617-8555 Japan

Phone : 075-955-6355(Company Desk)

　　 080-6100-4138 (mobile phone)

E-mail : takahiro.sezai.jc@murata.com

***************************************************************

over 1 year ago

0 Hannah Grace over 1 year ago

TI__Genius 15125 points

Hello,

Thank you for your question.

I am currently reaching out to our packaging department to see if they can clarify this issue for you.

Thank you for your patience.

Best Regards,

Hannah

0 Hannah Grace over 1 year ago

TI__Genius 15125 points

Hello,

Thank you again for your question.

Here are some comments from packaging:

1) Solder wetting is not guaranteed on sidewall for a normal QFN or DQN package.

2) The pad surface is intended to be soldered down. This is stated following the SMT solder pattern in the datasheet. If this pad is not soldered down, then yes, there will be concerns with electrical characteristics and reliability.

Hope this helps!

Best Regards,

Hannah

0 Takahiro SEZAI over 1 year ago in reply to Hannah Grace

Prodigy 40 points

Hello

Thank you for your answer.

I would like to check if the paraphrase of 2 is correct.　Please answer ２）

1) We got it. [Close]

2)"The pad surface is intended to be soldered down. If this pad is not soldered down, there will be concerns with electrical characteristics and reliability." Green means “If this pad is soldered down, there will be “no concerns” with electrical characteristics & reliability”, right ?

Br. SEZAI

+1 Hannah Grace over 1 year ago in reply to Takahiro SEZAI

TI__Genius 15125 points

Hi,

2) Yes, if the pad is soldered down there will be no concerns with electrical characteristics and reliability.

Best,

Hannah

0 Takahiro SEZAI over 1 year ago in reply to Hannah Grace

Prodigy 40 points

Thank you ! I goy it.

Br. SEZAI

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TLV741P: Solderbility about "Cut side of the Cu frame"