TPS65133: TPS65133: Package WSON

Maurizio Tusè

Part Number: TPS65133

Tool/software:

Dear TI experts,
more than a question I would like to ask a complaint.
I find the TPS65133 integrated circuit very good for many applications.
Its precision and low ripple distinguish it.
But presenting it with only one package (the WSON), which also needs to be soldered underneath, I don't think is a good thing.
Couldn't you also produce it with the SOIC package for example?

over 1 year ago

0 Patrick Yao over 1 year ago

TI__Mastermind 34780 points

Hi Maurizio,

Unfortunately we only have WSON package for this device, may I know is there any inconvenience for you to assembly this package type?

Patrick

0 Maurizio Tusè over 1 year ago in reply to Patrick Yao

Prodigy 10 points

Hi Patrick!
Before putting an electronic board into production, you need to make a prototype.
While for production we can use a pick and place, for the prototype instead we cannot since there are a maximum of two pieces.
The WSON is difficult to solder underneath (exposed thermal pad) and to position perfectly since it is small.
I recommend that you consider other packages for the future.
Best regards,
Maurizio

0 Patrick Yao over 1 year ago in reply to Maurizio Tusè

TI__Mastermind 34780 points

Hi Maurizio,

Understood, we will consider more package type in future design.

Patrick

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TPS65133: TPS65133: Package WSON