Tool/software:
Hello,
according to PCN 20240723008.2 there is a change in bonding, mount compound and mold compound in UCC27201AQDDARQ1.
Can you give me an naswer if this change relates to form, fit, function factors? Any changes in parameters?
Probably different thermall parameters?
If possible I would prefer answer by email as this is confidential from my side and I dont want to share any other details, but we are using UCC27201AQDDARQ1 ic current project.
Adam