TPS7A4701-EP: PCB Thermal management

Hello,

Thank you for your thermal question.

Here is the equation:

(8V-5V) x 1A = 3W, (3W x 32.5 degC/W) + 40 C = 137.5 C, where 32.5 degC/W is the thetaJA datasheet value.

This device goes into thermal shutdown at 170 deg C, so there should not be a concern with operating at this temperature:

If you are concerned with this temperature over a substantial period of time, then yes, you can definitely add a heatsink to help thermal management.

Hope this helps!

Best,

Hannah

Hello,

This tool can help: PCB thermal calculator | Models & Simulators | TI Design Resources | TI.com

Best,

Hannah

With proper PCB design, you might not need an additional heatsink. However, ensure:

• At least 10 cm² of copper area directly under the LDO and around it.
• Thermal vias should be  connected to inner layers to help spread heat.
• A solid ground plane if possible, as it also helps with heat dissipation.

To know more about thermal management of high-frequency PCB, you can take a look at this write-up: 

www.pcbway.com/.../Thermal_Management_of_High_Frequency_PCBs.html