Tool/software:
Hello,
I have a PCB with CSD88584Q5DC MOSFETs, and I am planning to implement top-side cooling to the case. It appears that the top exposed heat slug has a layer of solder on it, making the surface uneven. Could you confirm if solder is applied to the top exposed heat slug? Also, what thickness of thermal pad would you recommend for effective heat transfer?
Regards
Céline