Tool/software:
Hi,
Need help with this customer inquiry. Can someone please respond on this post? I will share the link with the customer so that can continue the discussion here.
We have been purchasing CSD18533KCS direct from TI and our customer has been having field failures. We have since done a failure Analysis with SEM Lab and the conclusion from the analysis suggests the devices failed due to electrical breakdown at the source wire bonds to the die. The breakdown was most likely the result of die damage, i.e. bond cratering, due to the size of the source bond wires. In addition the lab stated the control sample we sent had a different bond orientation, which may have been an attempt to mitigate the damage by spreading the bonding load diagonally across the source contacts rather than parallel to these features.
We need to understand when and why the change was made and would like to set up a conference call to discuss as this is going to lead to a major recall
