TPSM82810: TPSM82810 heat dissipation problem consultation

Vayne Li

Part Number: TPSM82810

Tool/software:

Hi Teams,

Regarding the heat dissipation method of TPSM82810SILR, a power chip with a large capacitor on top, can it be attached to the metal casing for heat dissipation? thank you.

Do you have any good suggestions about heat dissipation methods？

10 months ago

0 Josef Marsmann 10 months ago

TI__Expert 7250 points

Hi Vayne,

Thanks for using E2E.

The TPSM82810 module with the inductor on the top is qualified over all "Recommended Operating Conditions" (see data sheet), so you don't need an additional heat dissipation method.

Best regards,
Sepp

0 Vayne Li 10 months ago in reply to Josef Marsmann

Expert 1150 points

Hi Josef,

Thanks for your reply,

Is there no need for heat dissipation when the customer's operating environment is around 55 ° C?

+1 Josef Marsmann 10 months ago in reply to Vayne Li

TI__Expert 7250 points

Hi Vayne,

No need for heat dissipation, correct.

Best regards,
Sepp

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TPSM82810: TPSM82810 heat dissipation problem consultation