This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Tool/software:
Why we need to consider NC pins of an IC while performing package failure mode distribution ?
Hi Karan,
I am answering for general device knowledge and not for this specific device. In many ICs, NC is still connected to the die and in case of any shorts, die can get damage.
I hope this explains/answers your question.
Best Regards,
Arush
Hi Arush,
Thanks for the justification. Whether the same is applicable to connectors as well ?
Hi Karan,
I don't fully understand you. What do you mean by connectors?
Best Regards,
Arush
Hi Arush,
Here my concern is
Suppose there is a connector of total pins 20 and in design only 10 pins are used then in that case whether can I do Reliability Calculation and Failure Mode Distribution using 10 used pins ?
Hi Karan,
tbh I am not very knowledgeable about the connectors and I don't want to share anything incorrect. I would suggest you to check the datasheet of connector for the mechanical diagram and also check this with the maker of connector.
Best Regards,
Arush
Hi Arush,
Thanks for your prompt responses.
Here I have one question regarding NC pins of an IC
As you said previously that NC pins also should be consider for Failure Mode distribution but when we are performing package failure mode distribution we are not aware about the die, whether the IC is build with single or multiple die in that case how we can do the analysis for NC pins.
Hi Karan,
The manufacturer can provide you the pin FMEA/FMD for the IC.
Best Regards,
Arush
Hi Arush,
Thanks for the response.
If suppose it is not provided by the manufacturer then what effect we can write for the failure modes like NC pin short to VCC and Short to GND.
You cannot say anything with confidence. If manufacturers FMEA doesn't have NC pin then most likely the die is not connected to that pin.
Hi Arush,
Greetings of the day !!
I have one query related to one of the TI IC : ADS7038-Q1
I have seen the pin failure mode distribution for the IC from the the attached link (https://www.ti.com/lit/fs/sbaa467/sbaa467.pdf?ts=1736311872398&ref_url=https%253A%252F%252Fwww.ti.com%252Fproduct%252FADS7038-Q1%253FkeyMatch%253DADS7038QRTERQ1%2526tisearch%253Duniversal_search%2526usecase%253DOPN-ALT)
In this Exposed Pad also considered in the pin failure mode analysis. So while performing reliability calculation using IEC 62380 standard whether number of pins should be considered as 16 or 17 (by including Exposed pad)
Hi Karan,
Kindly create another thread with ADS7038 part number. I am from power switch team and cannot help with this device. Based on part number, the experts will get assigned and they will help you.
Best Regards,
Arush
Hi Arush,
I have already created 3 days back but I m not getting any response so I thought I will check with you.
Hi Karan,
Got it. Unfortunately, I won't be able to do anything here since that team is completely different from mine.
Best regards,
Arush