Tool/software:
Hi, TI expert
The customer has been supplied with device with the marking on the right side of the table below since 2024.
As mentioned in the table above, there is a problem where reset occurs when a power surge is applied to the parts with the changed marking supplied since 2024.
Looking at the PCN document, it says that the marking of parts produced at TI Mexico has changed to the right-hand side parts when the Assembly site (TI Mexico) is added.
Only the Assembly site is added, and there is no information about the IC characteristics in the PCN.
[PCN attached]
The customer suspects that there is a difference in the characteristics of the ICs of the two parts with different markings.
Has there been a history of such problems occurring since the addition of the assembly site (TI Mexico)?
Are there any changes or differences in the characteristics of the ICs?
Please check. Thank you.
