Tool/software:
Team, Customer asking to get thermal cycling test reports of below two gate driver.
UCC5350MCDR
UCC5390SCDR
and it should be:
- Test Results according to the UL/IEC 62368-1 standard
- Test Results made by 3rd part.
Application: UPS
Regards
Brian
Hi Brian,
IEC 62368-1 is a standard for Audio/video, information and communication technology equipment. It seems to relate to the end-equipment.
I see a heat run test in Table G.5.2.2, but no IC thermal cycling criteria.
You can search for the thermal cycling data we do have available through ti.com:
In this case, the standard that TI has followed for thermal cycling qualification is JESD22-A104:
Best regards,
Sean
Hi Brian,
That report is titled "Audio/video, information and communication technology equipment – Part 1: Safety requirements". It includes a section about thermally induced burns and "basic safeguards". This does not appear to be an IC component-level standard.
Can you clarify your customer's expectation? We have a thermal resistance in the datasheet that you can use to estimate the IC's temperature based on a given power dissipation.
I copied a section of IEC62368-1 below that I see refers to thermal cycling. It appears related to pollution degree 1 testing. I have emailed our manufacturer of G634A mold compound, which is used for UCC5350MCDR, to see if that supplier has any test results related to pollution degree 1 thermal cycle tests.
Best regards,
Sean
