UC1845-SP: Change in Thermal Resistance from previous datasheet release?

Terry Muy

Part Number: UC1845-SP

Tool/software:

Hi,

I noticed that was a significant increase on the thermal resistances, junction to board from the previous version compared to the most updated version. What cause these values to increase? Also is there any thermal resistance info for a 8 Pin CDIP package?

7 months ago

0 Sarah Koch 7 months ago

TI__Genius 11950 points

Hi Terry,

Please allow me a day or 2 to look into your question. Since the CDIP package is not explicitly listed, the changes may only apply to the non-space-grade parts that share the electrical datasheet with the UC1845-SP. I may need to submit a thermal modeling request for the CDIP package, which would take a week or 2 to complete.

Thanks,

Sarah

+1 Daniel Hartung 6 months ago in reply to Sarah Koch

TI__Mastermind 28425 points

Hey Terry,

We were able to do thermal modeling on the package and got the following values

Thanks,
Daniel

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UC1845-SP: Change in Thermal Resistance from previous datasheet release?