LMZ13610: Baking Procedure

TS Tan1

Part Number: LMZ13610

Tool/software:

We have parts that have exceeded floor life, which require baking prior to use. It is not clear in the document of its baking procedure.

LMZ13610 has body thickness of 5.9mm, therefore not listed in Table 5 of AN-2029.

1) What is TI's recommendation for baking this part?

2) Is there option to bake at 150C for shorter duration?

Thanks.

0 Andrew Kutzler 7 months ago

Hi TS,

LMZ13610 meets IPC/JEDEC-020 standard, and the MSL rating is LEVEL-3-245C as it is shown in d/s.

You can refer to the link below about the IPC/JEDEC-020.

Thanks

Andrew

0 TS Tan1 7 months ago in reply to Andrew Kutzler

Hi Andrew,

The concern is about baking procedure to reset the floor life, not about reflow procedure. J-STD-020 is all about reflow.

I think the more appropriate reference is J-STD-033.

1) Both J-STD-033 and AN-2029 do not list recommendation for package thickness greater than 4.5mm. What does TI recommend for LMZ13610?

2) Per J-STD-033B.1 clause 4.2.7.1, supplier should be consulted for possibility of using 150C. What is TI's comment?

Thanks.

0 Andrew Kutzler 7 months ago in reply to TS Tan1

I will check.

-Andrew

Power management forum