TPS40210-Q1: power pad

Akihiro Hirata

Expert 6210 points

Part Number: TPS40210-Q1
Other Parts Discussed in Thread: TPS40210

Tool/software:

Hello team,

The power pad of TPS40210-Q1 is connected to other pins internally, such as GND? or not internally connected?

Regards,

Hirata

7 months ago

+1 Niklas Schwarz 7 months ago

TI__Mastermind 30210 points

Hi Hirata-san,

Thanks for creating a new thread in e2e.

The thermal pad has an electrical connection to the silicon substrate.
This means it is not isolated from GND.

For layout, we still recommend to connect the thermal pad to the GND plane on the PCB.

Best regards,
Niklas

0 Akihiro Hirata 7 months ago in reply to Niklas Schwarz

TI__Expert 6210 points

Hi Niklas-san,

Thanks for your answer. I understand.

I appreciate your support.

Regards,

Hirata

0 Akihiro Hirata 6 months ago in reply to Akihiro Hirata

TI__Expert 6210 points

Hi Niklas-san,

Niklas Schwarz said:
The thermal pad has an electrical connection to the silicon substrate.
This means it is not isolated from GND.

This means the thermal pad and GND is connected through high impedance equivalently, right?

The switching current is mainly flowing through the GND pin, not thermal pad, correct?

Even if the power pad becomes floating accidentally, the IC won't get damage by itself, correct? (there is no good head conduction path so thermal would be tough though)

Regards,

Hirata

+1 Niklas Schwarz 6 months ago in reply to Akihiro Hirata

TI__Mastermind 30210 points

Hi Hirata-san,

Yes, you are correct.
All ground current flow is happening via the GND pin, not the thermal pad.

If the thermal pad becomes floating, no device damage is to be expected.
I agree that thermal behavior would be worse. As the TPS40210 has no overtemperature protection, it could destroy itself through overheating.

Best regards,
Niklas

0 Akihiro Hirata 6 months ago in reply to Niklas Schwarz

TI__Expert 6210 points

Hi Niklas-san,

Thanks so much!! I understand.

Regards,

Hirata

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TPS40210-Q1: power pad