LM2757: My customer want to know below IC bonded material and whether they can meet below requirement. Could you please help check and reply today?

Hale Tan

Part Number: LM2757

Tool/software:

Hello Team,

Posting on behalf of my customer:

My customer want to know below IC bonded material and whether they can meet below requirement. Could you please help check and reply today?

ELFR

JESD22-A108;
JESD74

Tj≥125℃,Vcc≥Vccmax

follow EFR failure rate requirement

0 Fail

LM2757TM/NOPB

6 months ago

0 Nini Zhong 6 months ago

TI__Genius 13315 points

Hi I will check with the PE and feedback you later.

0 Nini Zhong 6 months ago in reply to Nini Zhong

TI__Genius 13315 points

Could I ask what is the end customer?

0 Hale Tan 6 months ago in reply to Nini Zhong

TI__Expert 3770 points

Hi Nini,

The end customers are Source photonics.

0 Nini Zhong 6 months ago in reply to Hale Tan

TI__Genius 13315 points

Hi Hale,

You could use this web to search :Quality, reliability, and packaging data download | TI.com

It seems the device doesn't include this test . But what you mentioned normally only cover the LBC10 device. For some LBC9 or older devices, the process is more mature and don't need this test.

0 Hale Tan 6 months ago in reply to Nini Zhong

TI__Expert 3770 points

Ok. So based on the test requirement, TI can support . Is that right?

0 Nini Zhong 6 months ago in reply to Hale Tan

TI__Genius 13315 points

Hi Hale,

For LM2757TM/NOPB, TI doesn't support this test .

Power management

Power management forum

LM2757: My customer want to know below IC bonded material and whether they can meet below requirement. Could you please help check and reply today?