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Original question:

LMG3422R050:熱抵抗について

LMG3422R050:ジャンクション-パッケージ上面の熱抵抗について

Kaname Tominaga
Prodigy 20 points
Part Number: LMG3422R050
Other Parts Discussed in Thread: LMG3522R050,

Tool/software:

ジャンクション・パッケージ上面の熱抵抗(赤い斜線で示しています)はデータシートに記載されていませんが、そのデータはありますか?また、ジャンクションとパッケージ上部のジャンクションに最も近いポイントとの間の熱抵抗に関するデータはありますか?もしそうなら、ご指導をお願いいたします。

  • 0
    TI__Intellectual 1220 points

    Hi,

    I will get back to you regarding the top side thermal resistance values after referring to our thermal design expert.

    Meanwhile, I would like to understand if there is any specific reason for preferring the bottom side cooled solution instead of the available alternate part in top side cooling (LMG3522r050). 

    Thanks,

    Subhransu

  • 0 in reply to Subhransu Satpathy
    TI__Expert 4935 points

    Hi Kaname, 

    We do not have any data available for the junction-case-top thermal resistance. This is because this GaN device is only designed to dissipate heat through the bottom of the case, which has the thermal pad. The junction-case-bottom thermal resistance is available in the datasheet and is 0.88 C/W. 

    As Subhransu mentioned, if top-side cooling is preferred, LMG3522R050 would be the best part to use here. 

    Thanks,

    John

  • 0 in reply to John Gomez
    Prodigy 20 points

    Thank you for your instruction.

    I understand that the LMG3422R050 dissipates heat from the bottom and there is almost no heat dissipation from the top of the package, so the top of the package approaches the junction temperature.