Tool/software:
- Did TI make a design change between July 2022 and October 2024 that resulted in the changes to maximum lead temperature and package thermal impedance as cited in the October 2024 datasheet?
- Was a PCN issued for the 300mm redesign and did that redesign result in any updates to the October 2024 datasheet?
- Is there a date code associated with cut in of the October 2024 datasheet revision?
- When TI tests each part for functionality, is it done at any temperature other than room temp?