Tool/software:
Hi
Q1.
In datasheet page17 mentioned about "Kelvin connection", what is this mean?
From below suggested layout, it looks like connect these pins all together in surface layer, then have via connect to inner layer.
Q2. only 5GND via is enough?
If we would like to add more GND via, which area is preferred?
Red circuit under IC package? or blue circuit outside IC package?
BR
Ethan
Dear Sir,
Pls find below figure for a good example of Kelvin connection:
And with regard to the GND vias, usually it's good to place enough GND vias in order for a better thermal dissipation. The datasheet only shows layout for your reference but does not mean that you must only place 5 vias under the device. The GND vias which are placed close to the IC will be more useful. Thank you!
BRs
Lucia
