Other Parts Discussed in Thread: UCC23525
Tool/software:
Hi team,
Does TI have p2p solution to replace TLP5711? Seems package size is different.
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Hi Jimmy,
The UCC2311 or the newer UCC23525 are good P2P substitutes in the DWY package:
The package width and the PCB footprint required for a TI DWY package is the same as the Toshiba version you have shown. This Toshiba package does have a shorter height from the PCB. The TI device stands 3.3mm above the board.
Toshiba has a smaller version of this device for which TI does not have a P2P equivalent.
Best regards,
Sean
Hi Jimmy,
The package width is different, but the footprint on the PCB is the same. Is the issue that it is abutting other components on the PCB?
Best regards,
Sean