• State Resolved
  • Locked Locked
  • Replies 1 reply
  • Subscribers 63 subscribers
  • Views 129 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS76201-Q1: TPS76201QDBVRQ1 - AEC-Q100

Todd Manning
Prodigy 55 points
Part Number: TPS76201-Q1

Tool/software:

The datasheet for TPS76201QDBVRQ1 says it is "Qualified for Automotive Applications" is there any AEC-Q100 screening information available?  Or, is there data that shows AEC-Q100 equivalent screening for this part?

  • +1
    TI__Expert 5510 points

    Hi Todd,

    We qualify all automative parts to the current version of AEC Q100 at the time the device was released (Source).

    You can find more detailed information on qualification tests here:

    Type AEC Q100 test # Test spec Min lot qty SS / lot Test name Condition Result Notes
    Test group A - accelerated environment stress test
    THB/HAST A2 JESD22-A101/JESD22-A110 3 77 Biased HAST 130C/85%RH 96 hours Pass Or equivalent Q100 condition
    AC/UHAST A3 JESD22-A102/JESD22-A118 3 77 Unbiased HAST 130C/85%RH for 96 hours Pass Or equivalent Q100 condition
    TC A4 JESD22-A104 3 77 Temperature cycle Per grade requirements. See data sheet. Pass —
    TC-WBP A4 MIL-STD883 method 2011 1 30 Post temp cycle bond pull Per requirements Pass As applicable per die configuration
    HTSL A6 JESD22-A103 1 45 High temp storage bake Per grade requirements. See data sheet. Pass —
    Test group B - accelerated lifetime simulation test
    HTOL B1 JESD22-A108 3 77 High temperature operating life Per grade requirements. See data sheet. Pass —
    ELFR B2 AEC Q100-008 3 800 Early life failure rate Per grade requirements. See data sheet. Pass —
    Test group C - package assembly integrity tests
    WBS C1 AEC Q100-001 1 30 Wire bond shear Cpk > 1.67 Pass As applicable per die configuration
    WBP C2 MIL-STD883 method 2011 1 30 Wire bond pull Cpk > 1.67 Pass As applicable per die configuration
    SD C3 JEDEC J-STD-002 1 15 Solderability >95% lead coverage Pass —
    PD C4 JESD22-B100 and B108 3 10 Physical dimensions Cpk > 1.67 Pass —
    SBS C5 AEC Q100-010 3 5 balls from 10 devices Solder Ball Shear Cpk > 1.67 Pass As applicable per die configuration
    Test group D - die fabrication reliability tests
    EM D1 — — — Electromigration Per technology requirements Pass —
    TDDB D2 — — — Time dependent dielectric breakdown Per technology requirements Pass —
    HCI D3 — — — Hot carrier injection Per technology requirements Pass —
    BTI D4 — — — Bias temperature instability Per technology requirements Pass —
    SM D5 — — — Stress Migration Per technology requirements Pass —
    Test group E - electrical verification
    HBM E2 AEC Q100-002 1 3 Electrostatic discharge - human body model Per AEC Q100-002 See data sheet —
    CDM E3 AEC Q100-011 1 3 Electrostatic discharge - charged device model Per AEC Q100-011 See data sheet —
    LU E4 AEC Q100-004 1 3 Latch-up Per AEC Q100-004 Pass As applicable per Q100-004
    ED E5 AEC Q100-009 3 30 Electrical distributions Per AEC Q100-009 Pass —

    Feel free to let me know if there was something more specific you were looking for.

    Best,
    Gregory Thompson