TPSM828512: SW pin handling

Dice-K

Mastermind 7480 points

Part Number: TPSM828512

Tool/software:

Hi support team,

I think the SW pin should be "unconnected" to reduce EMI, and "be soldered to a small pad" to dissipate heat.

Is the SW pin "unconnected" in the "Thermal Information" measurement conditions?

I visually inspected the TPSM828512EVM, but I cannot determine whether it is "unconnected."

Ultimately, I would like to know the recommended method for handling the SW pin.

Regards,
Dice-K

5 months ago

0 Varun John 5 months ago

TI__Mastermind 21560 points

Hi Dice-K,

On the EVM, the SW pin is only connected to it's corresponding pad on the IC footprint. It's not connected to any other plane or trace.

You can refer to the EVM users guide to check the layout https://www.ti.com/lit/ug/slvucp5/slvucp5.pdf

The thermal information section has the SW pin connected as in the EVM.

I've highlighted in red the SW connection on the EVM.

Best regards,

Varun

0 Dice-K 5 months ago in reply to Varun John

Mastermind 7480 points

Hi Varun,
Thank you for your reply.

Is the recommended treatment for SW pin to be connected to a small independent PAD rather than being unconnected?

Best regards,
Dice-K

+1 Varun John 5 months ago in reply to Dice-K

TI__Mastermind 21560 points

Hi Dice-K,

Yes there should be a land pad for the SW node, and SW needs to be soldered to the land pad. Otherwise it can result in a overall poor soldering of the IC to the PCB.

You can refer to the page 29 of the datasheet for the land pattern.

Best regards,

Varun

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TPSM828512: SW pin handling