Tool/software:
Hello,
with the PCN No. 20240409000.1 I have been informed, that the dimensions of the thermal pad will change.
Firstly, I am wondering how this will not affect the thermal performance and related datasheet values (Rth,jc etc).
Is it true that the thermal performance will not be affected?
When I checked the latest datasheet, I did not find any change log that mentions the thermal pad change:
In Revision A the pad size was specified as 2.4 x 3.1 mm.
In Rev. C on page 33 the pad is specified as 2.7 x 3.4 mm max, whereas on page 37 it is specified as 2.4 x 3.1 mm max.
Which is the correct dimension? And why was the change in pad size, land pattern, stencil design, etc. not indicated in the revision history or PCN?
--> This could have a critical impact on applications if there are requirements for clearances, traces near the pad or even the manufacturing (soldering) process!
