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TPS54362-HT: Layout

Nacho Martinez
Prodigy 135 points
Part Number: TPS54362-HT
Other Parts Discussed in Thread: LM5116-HT

Tool/software:

Hi there,

I am designing a PCB with two power stages. The first one is based on TPS54362HPWP (3V3@1A) and the second one is based on the LM5116-HT (12V@6A).

Reading the TPS datasheet, I found this paragraph:

"In a multilayer PCB, the ground plane is used to separate the power plane (high switching currents and components are placed) from the signal plane (where the feedback trace and components are) for improved performance."

I cannot understand prorperly this paragraph. If I define my stackup as "1.Sig 2.GND plane 3.3V3 Plane 4.GND Plane. 5. 12V plane 6.Signal", it is not possible to place on the layer 3 another kind of signal that it is not 3V3 signal or Vin Signal (is a full filled plane).

Is there an error on the datahseet when it sais "the ground plane is used to separate the power plane"? Is it meaning that you can use a signal plane divided on power and signal?

If yes, I think not having a full filled GND plane may cause signal integrity problems.

Best regards.

  • 0
    TI__Guru 72835 points

    Hello

    I agree that the wording is confusing.

    The best way to lay out the design is to follow the sketch in the data sheet for the top side (component side).

    Then, use a solid ground plane on the next layer below connected to the top side ground.

    The other layers can be signal.  It is also best to have a ground layer on the bottom for heat sinking.

    Thanks