TPS82130: Thermal characteristics of the component

Alexander Skulsky

Prodigy 50 points

Part Number: TPS82130

Tool/software:

the thermal parameters in the datasheet were not updated

the Junction to board is still smaller than junction to case.

5 months ago

0 Andy Chen 5 months ago

TI__Mastermind 34745 points

Hi,

Can you specify which thermal metric you mean?

0 Alexander Skulsky 5 months ago in reply to Andy Chen

Prodigy 50 points

there is a thread on the forum regarding the thermal resistance mismatch. The Junction to board is higher than the Junction to case and this doesn't make sense

0 Andy Chen 5 months ago in reply to Alexander Skulsky

TI__Mastermind 34745 points

Let me check and update you later....

0 Andy Chen 5 months ago in reply to Alexander Skulsky

TI__Mastermind 34745 points

Hi Alex,

The thermal data on present data sheet was simulated with different definition. pls refer to the new data which refer to package bottom or the external board to mount the module. Sorry for the confusion.

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TPS82130: Thermal characteristics of the component