Tool/software:
From a previous post on the NiAu termination finish..."the CSD23382F4 termination finish is 1um Ni and 0.08um Au" Can you tell me what type of plating process is used on this part? I have a very old correspondence from TI Customer Service that states the termination finish on the CSD23382F4 is "electroless-nickel-immersion-gold (ENIG)", but I question that because the ENIG plating process is typically used on printed circuit boards, whereas electroplating is more commonly used on component terminations. The reason for my question is related to gold removal requirements in J-STD-001H, which shows an exemption for "ENIG" plated finishes.
