BQ76922: Land pattern and solder aperture recommendations

Vaibhav Khatri

Part Number: BQ76922

Tool/software:

Hello,

I am trying to find soldering land pattern recommendations for BQ76922, its package family is WQFN and its TI package name is RSN.

I tried finding it on TI's package finder page as well, I found the respective TI package and its pattern drawing.

In this drawing only IC dimensions are shown not the recommended land pattern and solder paste aperture.

Please provide the land pattern recommendations and solder paste aperture dimensions.

Thanks

Vaibhav

0 Alexis_H 5 months ago

Hello Vaibhav,

Thank you for bringing this to our attention. I am working with the team on addressing this.

Best Regards,
Alexis

0 Luis H. S. 4 months ago

Hello Vaibhav,

The last few pages of the datasheet now show this. Thanks for bringing it up.

Best Regards,

Luis Hernandez Salomon

0 Vaibhav Khatri 4 months ago in reply to Luis H. S.

Hi Luis,

Page no. 72 still shows the same as can be seen in the older datasheet.

0 Alexis_H 4 months ago in reply to Vaibhav Khatri

Hello Vaibhav,

Thank you for bringing this up. We are currently looking into this.

Best Regards,
Alexis

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