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TPSM82821: Recommendations for hand soldering footprint

Seth Giles
Prodigy 10 points
Part Number: TPSM82821

Tool/software:

Hello,

A client is entertaining the thought of using the TPSM828213SILR for an embedded design, but the first article I am developing for them will be assembled in house. I regularly hand-solder 0201 packages, which _approximately_ matches the pin pitch of the uSiL package.
I have experienced difficulty in hand-soldering pinless packages in the past unless I extend land pads out where I can get good contact with an iron.

Are any recommendations out there for hand-soldering land patterns for the uSiL package?

Thank you!

  • 0
    TI__Mastermind 22530 points

    Hello Seth,

    thanks for reaching out in E2E.

    The land pattern of the TPSM828213SILR is described on page 48 of the datasheet.

    For hand-soldering you could try to follow the Component replacement process example in section 5 of this users guide: "Manufacturing and Rework Design Guide for MicroSiPTm Power Modules". I would suggest to use some board heating device for pre-heating and then try to emulate the air flow steps with a hot air gun.

    Best regards,

    Andreas.