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UCC21530: Wave Soldering Compatibility of UCC21530DWKR

Guru 12165 points
Part Number: UCC21530

Tool/software:

Hi,

We would like to confirm the recommended assembly method for the UCC21530DWKR device.

Since this device comes in an SOIC-Wide (DWK) surface-mount package, we understand that TI officially recommends reflow soldering. However, due to certain manufacturing line constraints, we have received a request from our customer asking whether this device can be wave soldered (flow soldering).

Could you kindly provide clarification on the following points?

  1. Is UCC21530DWKR compatible with wave soldering processes?

  2. If wave soldering is used, does TI support this method officially? Are there any concerns or risks associated with it?

Best regards,

Conor

  • Hi Conor,

    Since UCC21530 is not a through-hole device, reflow soldering is a more common method.

    We do not have any official guidance on whether this device can be used for wave soldering.

    This is typically a decision made by the PCB manufacturer.

    Hope this helps.

    Regards,

    Hiroki