Tool/software:
Hi,
We would like to confirm the recommended assembly method for the UCC21530DWKR device.
Since this device comes in an SOIC-Wide (DWK) surface-mount package, we understand that TI officially recommends reflow soldering. However, due to certain manufacturing line constraints, we have received a request from our customer asking whether this device can be wave soldered (flow soldering).
Could you kindly provide clarification on the following points?
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Is UCC21530DWKR compatible with wave soldering processes?
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If wave soldering is used, does TI support this method officially? Are there any concerns or risks associated with it?
Best regards,
Conor