Tool/software:
Hi Team,
I am looking into the TPS82130SIL, and I am trying to find out more information about the lead material thickness of the part. Can you provide what the thickness is of the gold layer on this device?
Thank you,
Filipe
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Tool/software:
Hi Team,
I am looking into the TPS82130SIL, and I am trying to find out more information about the lead material thickness of the part. Can you provide what the thickness is of the gold layer on this device?
Thank you,
Filipe
Hi Filipe,
Please refer this post: [FAQ] What is the thickness of Gold (Au), Palladium (Pd), or Nickel (Ni) for TI's NiPdAu lead finish? - Logic forum - Logic - TI E2E support forums
Regards,
Gautam
Gautam,
I do not think this fully answers my question as the TPS82130SIL has a NiAU lead finish whereas the FAQ you posted is for NiPdAU lead finish devices. Do they coincidentally happen to be the same? Or does the uSIP devices acually have Pd finishes?
Regards,
Filipe Rubinstein
Hi Filipe,
TPS82130SIL has a NiAU lead finish whereas the FAQ you posted is for NiPdAU lead finish devices.
Thanks for highlighting the same. You can refer this whitepaper. It mentions "For a PCB using a Ni/Au surface finish, the gold thickness should be less than 0.5 µm to avoid a reduction in thermal fatigue performance"