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TLV772: Thermal Calculation

Kyle Mehringer
Intellectual 1530 points
Part Number: TLV772
Other Parts Discussed in Thread: TPS746

Tool/software:

Hello,

We're looking to use TLV772(01) X2SON package for the two voltage conversions below:

  • Vin=1.8V, Vout=0.925V, Iout=0.3A
  • Vin=1.8V, Vout=0.8V, Iout=0.3A

Given the thermal resistance, for the worst case (Vout=0.8V), the Pd=(1.8V-0.8V)*0.3A = 0.3W. This would correlate to ~70C in temp rise of the device. At ambient temp = 50C, the junction temp will be ~120C, which is still just below the recommended max. Will 120C be acceptable, in your opinion?

Do you have a better recommendation (in a similar small package), that would be better thermally?

Thank you,

Kyle

  • 0
    TI__Expert 5080 points

    Hello Kyle,

    120'C is acceptable.

    The device functions reliably and electrical characteristic table values apply anywhere within the recommended operating conditions of -40'C to 125'C. It can operate at that junction temperature long term without issue.

    The TPS746 will also work in those conditions, but the package is a bit larger (though also still small). If you let me know your package size requirements I can find a better replacement.

    TPS746 TLV772
    Package WSON X2SON
    Body Size 2mm x 2mm > 1mm x 1mm
    RθJA 80.3'C/W < 236.2'C/W
    Vin Max 6.0V 6.5V
    Iout Max 1A 0.3A
    Vout Max 5.5V ~6.0V

    Best,

    Gregory Thompson

  • 0 in reply to Gregory Thompson
    TI__Intellectual 1530 points

    Hello Gregory,

    We will stick with the TLV772. Do you have a design calculator for this device? I didn't see one on ti.com.

    Thank you,

    Kyle

  • 0 in reply to Kyle Mehringer
    TI__Expert 5080 points

    Hello Kyle,

    Unfortunately, we don't have a calculator for this device, but I'd be happy to provide and explain any of the relevant equations for you

    Best,

    Gregory Thompson