• State
  • Locked Locked
  • Replies 5 replies
  • Subscribers 63 subscribers
  • Views 92 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS736: TPS73633MDBVREP Abnormal internal structure

yingjiao LI
Expert 1375 points
Part Number: TPS736

Tool/software:

Hi

We conducted an ultrasonic scan on this product and found that the pins in the internal bonding wire area were delaminated, and the pins were completely separated from the plastic packaging
Could you please help confirm what caused this? Is it normal? Does it affect usage
Thank you

  • 0
    TI__Intellectual 1910 points

    Hi yingjiao LI;'

    How many units have been ultrasonic scan?

    Please provide what is the lot # associated ?

    The image is not that great ...

    DO you have a much better image to look at?

     

    BR;

    Bett

  • 0 in reply to Bett Lofts
    Expert 1375 points

    Hi
    Please check the new pictures. Thank you

     

  • 0 in reply to yingjiao LI
    TI__Intellectual 1910 points

    Hi yingjiao LI;

    Does these new images same units taken from the previous images?  The delamination observed areas pointed differently , previous images delam was in the die paddle while the latest images delam at the Lead frame (middle pin ) which is the GROUND Pin .

    Why did you performed  ultrasound scan?

    Should be good to know the Lot # or the 2D Label for this affected  units in order to back track lot history?

    BR;

    Bett

  • 0 in reply to Bett Lofts
    Expert 1375 points

    Hi

    We found that there are layers in multiple parts, so the images are different

  • 0 in reply to yingjiao LI
    TI__Intellectual 1910 points

    Hi yingjiao LI;

    I am a little bit confused , what do you mean by layers in multiple parts? Are you referring customer assembled boards or  captured images from different parts?

    Our QSS spec QSS-009-044 says for lead finger: a) Bonding area : No delamination is allowwed b) Non-bonding area : Delamination allowed up to 50% of the non-bonding area length or 1mm whichever is less.

    It is hard to tell from the SAM images.  But appears to be the LF middle finger which is a Grnd pin and no wire bonded on the one that had delam.

    BR;

    Bett