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TPS7A4501-SP: PCB FOOTPRINTS FOR SOME SPACE QUALIFIED CFP PACKAGES

Part Number: TPS7A4501-SP
Other Parts Discussed in Thread: TPS7H1101A-SP, TPS7H1121-SP

Tool/software:

Hi:

What is the recommended PCB footprint / land pattern for the following CFP (Ceramic Flat Pak) packages?

  • 8 pin Thermally-Enhanced HKU Package for TPS7A4501-SP / 5962R1222403VXC
  • 16 pin Ceramic Flat Pak for TPS7H1101A-SP /
  • 22-pin CFP HFT for TPS7H1121-SP / 5962R2320301VXC

Thank you.

James Foo

  • Hi James,

    I have removed the email you left in your original post to help avoid unwanted emails and spam. You should get an email notification with my response to this post, but let me know if you would prefer to follow up further via email and I can contact you. 

    Please note that TI hasn't performed any kind of Board Level Reliability assessment on the example footprints we use as these are intended for general demonstration of the parts. It will be important for any user to determine a trim and form spec that meets their mission and BLR requirements.

    There are example footprints available for download for each part you listed in multiple different formats via Ultralibrarian. You can find them in the Design & Development section of the part web pages as shown in the screenshot below.

    Thanks,

    Sarah