TPS723-Q1: Which SOT pin is the best for heat removal on this part?

Luke Dyson

Part Number: TPS723-Q1

Tool/software:

Hello! I am working with this part and wanted to know what pin is the most efficient for the removal of heat. I have looked at some other negative regulators, and I believe the Vin pin would be used for most effective heat removal from the die. What are the considerations for this part? Is there no good answer? My PCB layout guy asked and I really was stumped. The datasheet does not appear to provide direct guidance. We are not using a ton of power, but wanted to know the best solution.

Thanks,

Luke

4 months ago

0 Ishaan Shetye 4 months ago

TI__Genius 13720 points

Hi Luke,

The recommended method of heat removal is from the GND pin. We recommend as large a GND plane and as thick a GND layer (or multiple layers) as design allows and then to connect the GND pin to this plane for most effective dissipation. Having large polygon pours on IN and OUT also helps with dissipation but GND is most efficient.

Regards

Ishaan

0 Luke Dyson 4 months ago in reply to Ishaan Shetye

Prodigy 20 points

Hi Ishaan, So you suggest the ground as the primary heat path, but also as many other paths as possible?

Regards,

Luke

0 Ishaan Shetye 4 months ago in reply to Luke Dyson

TI__Genius 13720 points

No, ground pin and ground pad are the TI recommended paths for heat extraction from the device.

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TPS723-Q1: Which SOT pin is the best for heat removal on this part?