Tool/software:
Hi,
We have 6x UCC5870-Q1 parts configured in 3 groups of two for each leg of an inverter application. Each group of 2 is on its own PCB. The PCB's are all in the same vertical orientation and there is no sources of additional heating or cooling.
We notice that the spread of temperatures (as measured by the oboard ADC) between devices is quite bad. In some cases +10°C.
The temperature profile seems to be device specific, as can move the gate driver boards around and still see the same temperature profile on the same PCB. This indicates its not something like a bad FET causing excessive temperature.
All of the package bodies measure about the same (~49°C) using a thermocouple proble.
All of the VREF pins are set to internal and measure about 3.975V each.
I am curious to know if this is normal / expected, or does this indicate some larger issue in our design?
Thanks
