Tool/software:
We kindly request the thermal modeling data and power dissipation characteristics for the component- TPS709. Including clarification on whether its thermal models is of the 2R type or lumped model type.
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Tool/software:
We kindly request the thermal modeling data and power dissipation characteristics for the component- TPS709. Including clarification on whether its thermal models is of the 2R type or lumped model type.
Hello Binahah
The datasheet has thermal information in section 6.4: https://www.ti.com/lit/ds/symlink/tps709.pdf
Please refer to the Application Note "Semiconductor and IC Package Thermal Metrics" https://www.ti.com/lit/an/spra953d/spra953d.pdf for details on the thermal information as specified in the datasheet.
I also recommend the application report "An empirical analysis of the impact of board layout on LDO thermal performance" https://www.ti.com/lit/an/slvae85/slvae85.pdf
Please let me know if you have additional questions.
Best regards,
Daniel Esparza