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TPS25854-Q1: resin encapsulation by potting

Yuta Nishie
Genius 4945 points
Part Number: TPS25854-Q1

Tool/software:

Hi,

1. Is it okay to seal an IC with resin encapsulation by potting?
I'm thinking of using urethane resin or epoxy resin as the potting material.

2. Please let me know if there are any conditions for resin sealing.

Best Regards,

Nishie

  • +1
    TI__Mastermind 46241 points

    Hello Nishie,

    We have not tried potting this part, so we do not have any data on this part being used with potting material before.

    It is recommended to test and evaluate it in your application with the expected temperature range.

    BR,

    Seong