LMR36506-Q1: About Flip Chip(SolderBump-CuPillar) products

Ken Jufuku

Part Number: LMR36506-Q1

Tool/software:

VQFN-HR packages such as the LMR36506MSCQRPERQ1 use a Flip Chip (Solder Bump-Cu Pillar) structure.
Since when has this technology been mass-produced by TI?
What is the total production volume achieved so far?

4 months ago

0 Niranjan Nair 4 months ago

TI__Genius 9480 points

Hi,

Production volume information is confidential, hence we cannot share.

Regards,

Niranjan

0 Ken Jufuku 4 months ago in reply to Niranjan Nair

Prodigy 20 points

Hi,

Then, could you tell me when TI started mass production of the Flip Chip (Solder Bump-Cu Pillar) structure package?

0 Niranjan Nair 4 months ago in reply to Ken Jufuku

TI__Genius 9480 points

Hi,

Let me check internally and get back to you

Regards,

Niranjan

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LMR36506-Q1: About Flip Chip(SolderBump-CuPillar) products