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Original question:

TPS929240-Q1: MSL 3 packaging not completely vacuum

UCC5350: Packaging

Gabriele Manetti
Prodigy 10 points
Part Number: UCC5350

Tool/software:

Hi Team,

I'm Gabriele Manetti from ABB E-moblity Italy.

We are receiving many components (such as UCC5350 and others) that have packaging with air inside. Since these are MSL2 components, can we still use them? Is the presence of air inside sealed packages compliant?

please reply ASAP

thanks

  • 0
    TI__Mastermind 23176 points

    Hi Gabriele,

    Here is a link to our document about MSL ratings: https://www.ti.com/lit/an/spraby1a/spraby1a.pdf 

    As long as the bag is sealed, the devices will be protected from air humidity by the desiccant. Once you open the bag, the units are recommended to be placed onto a PCB within 1 year. You should still check the  humidity control card to make sure that the inside of the bag was sufficiently dry. 

    You can always bake out the assembled PCB if you have concerns that the parts have been exposed to moisture. However, humidity levels below 60% and temperatures below 30C increase the floor life to longer than this standard suggests.

    Best regards,

    Sean

  • 0 in reply to Sean Cashin
    Prodigy 10 points

    Hi Sean,

    Thanks for your fast response. We have received many components in bags that are not dry-packed. If you look at the pictures, you can see that there is air inside the bags. My first question is: Is this condition (with air inside the bag) acceptable, and is the air present when TI ships the components, or is the bag perforated during transportation, allowing air (and humidity) to enter?

  • 0 in reply to Gabriele Manetti
    TI__Mastermind 23176 points

    Hi Gabriel, 

    Yes, devices are commonly shipped in bags that are air-tight, but contain some trapped air. There should be a packet inside the sealed bag labeled "Desiccant: Do not Eat". This packet will absorb the water from the air and protect the IC from humidity.

    If the bag is perforated during transit, then the humidity might saturate the desiccant, and you should consider a bake-out of your final PCB to remove any humidity.

    Best regards,

    Sean