Tool/software:
We are working on a Non-Safety Remote I/O system , for output side we have used Texas TPS274160A. While discussing IC’s THER pins we came across few queries related to correct method of thermal fault clearing .
I am putting my doubts below, it would be great if could provide some clarity .
referring to this snip from the datasheet
Case 1 : When THER pin is permanently connected to low logic - When fault occurs Auto retry mode it activated. Here Thermal fault gets cleared when Tj <T (sd,rst) OR after toggling the Enx pin.
Case 2: When THER pin permanently connected to high logic , when fault occurs channel latches off and it will remain off until thermal shutdown fault signal is cleared .
1st method to clear fault signal : Step1 . Pull THER pin to low logic to start auto retry mode , Step 2. Toggle respective ENx pin.
2nd Method to clear fault signal : Step 1. Directly toggle respective Enx pin , with its THER pin pulled up.
Case 3 : Connect THER pin to MCU , with initial status pulled high , under fault condition channel latches off , after some delay pull THER pin low to start auto-retry mode , after this toggle ENx pin to clear fault signal. Once fault signal is cleared again pull THER pin high.
Q1. In case 2 , which is the correct method for clearing the fault signal.
Q2 . Out of the 3 case , which one is recommended
Kindly share your views on how to configure THER pin.