LP8732-Q1: Heat dissipation compound

Shunsuke Yamamoto

Part Number: LP8732-Q1

Tool/software:

Hi team,

My customer has been considering to put the cooling component and heat dissipation compound on LP8732-Q1. Are there any restricted places around LP8732 not to put heat dissipation compound on?

Best regards,

Shunsuke Yamamoto

2 months ago

0 Sarah Lao 2 months ago

TI__Genius 9157 points

Hi Yamamoto-san,

There should be no concern with adding a heat dissipation compound on LP8732-Q1. There are no restricted areas.

This is not required and generally our EVMs and reference designs for LP8732 do not use any cooling/heat dissipation compounds.

Best Regards,
Sarah

0 Shunsuke Yamamoto 2 months ago in reply to Sarah Lao

TI__Expert 7641 points

Hi Sarah-san,

Thank you for the reply. It is good to know that LP8732 is not ecpected to mount cooling device on.

Are there any The contact pressure of LP8732-Q1?

Best regards,

Shunsuke Yamamoto

+1 Sarah Lao 2 months ago in reply to Shunsuke Yamamoto

TI__Genius 9157 points

HI Yamamoto-san,

We do not have any information regarding the contact pressure of LP8732-Q1. Apologies.

Best Regards,
Sarah

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LP8732-Q1: Heat dissipation compound