CSD18501Q5A: Fully RoHS compliant (Not claiming 7(a) exemption) drop-in replacement parts requested

Hi Ramesh,

Below is the input from my colleague:

• Below parts use 7(a) exemption.  EU notification does not state that it is discontinuing the exemption at the Dec 2026 expiration.  The current notification draft suggests the earliest expiration date of Dec 2026 for non-sub-exemption wording (in the current form):  RoHS Exemption 7(a) - Current Form: "Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead)“and Dec 2027 for the sub-exemption version.
• The suggested sub-exemption form has a suggested expiration date of Dec 2027.  Examples of the suggested sub-exemption options are:

Lead in high melting temperature type solders (i.e., lead-based alloys containing 85 % by weight or more lead) when used for the following applications (excludes those in the scope of exemption 24):

• • I) for internal interconnections for attaching die, or other components along with a die in semiconductor assembly with steady state or transient/impulse currents of 0.1 A or greater or blocking voltages beyond 10 V, or die edge sizes larger than 0.3 mm x 0.3 mm
  • II) for integral (meaning internal and external) connections of die attach in electrical and electronic components, if the thermal conductivity of the cured/sintered die-attach material is >35W/(m*K) AND the electrical conductivity of the cured/sintered die-attach material shall be >4.7MS/m AND solidus melting temperature has to be above 260°C
  • III) In first level solder joints (internal or integral connections - meaning internal and external) for manufacturing components so that subsequent mounting of electronic components onto subassemblies (i.e., modules or sub-circuit boards or substrates or point to point soldering) with a secondary solder does not reflow the first level solder. This item excludes die attach applications and hermetic sealings
  • IV) In second level solder joints for the attachment of components to printed circuit board or lead frames: 1. in solder balls for the attachment of ceramic ball-grid-array (BGA) 2. in high temperature plastic over-mouldings (> 220 °C)
  • V) as a hermetic sealing material between: 1. a ceramic package or plug and a metal case, 2. component terminations and an internal sub-part
  • VI) for establishing electrical connections between lamp components in incandescent reflector lamps for infrared heating or high intensity discharge lamps or oven lamps
  • VII) for audio transducers where the peak operating temperature exceeds 200°C
• The semiconductor industry does not have an alternate PbFree solution for RoHS exemption 7(a) and therefore EU will have to extend the exemption beyond Dec 2027, usually for an additional 5 years.
• Since several consortiums have objected to the split into sub-exemptions, we are hoping that EU will not require it.  However, just in case EU remains adamant to keeping the sub-exemption draft, TI products would fit to sub-exemption (i); therefore, if required, it could be classified as 7(a)-I
  • Lead in high melting temperature type solders (i.e., lead-based alloys containing 85 % by weight or more lead) when used for the following applications (excludes those in the scope of exemption 24):
  • I) for internal interconnections for attaching die, or other components along with a die in semiconductor assembly with steady state or transient/impulse currents of 0.1 A or greater or blocking voltages beyond 10 V, or die edge sizes larger than 0.3 mm x 0.3 mm

Please let us know if you have any additional questions.

Best Regards,

John