Tool/software:
Hi team,
I am confused by TLV1117 datasheet. Based on datasheet, this part has two version: legacy chip and new chip. New chip provide two package options: DCY and KVU, legacy chip provide 4 options: KTT, KCT, KCS, and DRJ. (see page 1, datasheet). However, from section '5.4 Thermal Information (Legacy chip)', you can find, the legacy chip has all kinds of 8 package options!
Based on section '8.1.1 Device Nomenclature', the legacy or new chip can be differentiated based on packaging label. My question is, How can customer know the devices they are booking is new or legacy chip? How can a customer designates legacy or new chip when they place order to TI?
In terms of performance, based on datasheet, it seems new chip support ceramic output cap ("5.3 Recommended Operating Conditions" says Cout ESR requirement is 2m ohm to 500m ohm). While my customer reported their TLV1117-33IDCY (based on datasheet page 1 it should be new chip.) output is unstable when working with 10uF/10V X5R ceramic cap, and the device can work stably when changes Cout to 10uF tantalum cap. Is this a legacy chip? How should we differentiate legacy or new chip? what is the requirement for COUT for legacy or new chip? This part is really confused.
Thank you!
John